On September 6, 2025, Yanshan Technology announced a major technical breakthrough, becoming the first in the industry to achieve an 8-inch silicon-based GaN MicroLED hybrid integration process, marking a significant step forward in MicroLED technology.
This breakthrough addresses key technical bottlenecks in the MicroLED field, including high-density integration, precise alignment, and efficient heat dissipation, providing a solid technical foundation for the large-scale commercial application of MicroLED displays.
Core Technology Breakthrough
The hybrid integration process is one of the core technologies for MicroLED commercialization. Yanshan Technology's R&D team, through years of dedicated research, has successfully developed an innovative process solution that achieves high-density integration and precise alignment of MicroLED chips on 8-inch silicon substrates, significantly improving production efficiency and product yield.
About Us
Yanshan Technology always adheres to technology-driven development, continuously increasing R&D investment, attracting top talent globally, and building a world-class MicroLED technology R&D team. The company has multiple core patents and continues to lead the development direction of MicroLED technology.